Copper Clad Laminate (Copper Clad Laminate) is a core material used in the fabrication of printed circuit boards. It is a composite material made up of a layer of copper foil, a substrate, and an adhesive. The copper foil is typically applied to the substrate with an adhesive layer in between, creating a laminate material. Copper Clad Laminate is also known as copper-covered la... https://www.hycxpcba.com/blogs/copper-clad-laminate.html